About EB-LCM Technology Corporation

Advancing Innovation:
A Legacy of Excellence in LCD and LED Technology

EB-LCM is established upon over 20 years of combined experience among its founders in the LCD display and LED backlighting industry. Specializing in innovative high-brightness LCM (LCD Module) solutions for the high-brightness application market, our commitment extends beyond product innovation. We prioritize understanding and meeting customer needs, emphasizing consistent delivery of quality products and timely shipments as core values upheld daily.

Global Excellence:
Delivering Tailored Solutions with Precision and Timeliness

We are strategically situated in Southern California, specifically in Los Angeles, to provide comprehensive support and service to customers in the United States and Europe. Our research and development team, along with a fully equipped production facility, is based in Tao-Yuan City (Yang Mei District), Taiwan. This dual-location setup ensures customers receive real-time assistance, prompt responses, and timely production tailored to their specific requirements. With a dedicated team of 75 staff members at our Taiwan research and development and production facilities, alongside 150 employees at our production facilities in China, we are committed to delivering excellence in service and product offerings.

What EB-LCM can do?

  • Design and Manufacture of LCD Modules (LCDM) in Taiwan.
  • Enhancement of Brightness: LCD Module Design and Manufacturing
  • Services.
  • Capacitive Touch and Cover Glass Hard-to-Hard Manufacturing Capability.
  • Display Information System Utilizing Ad-Hoc Wireless Protocol.
  • System on Board Incorporation onto LCDM.
  • Additional Services:
  • a. Standard Format LCD Module Resizing Services.
  • b. Free-Shape LCD Module Scribing According to Profile Shape.
Contact Us

Factory Layout

(LY – Yang-Mei Facility Taiwan)

1F
Fab area：185 square meters class 1000     
Clean BOX & Attachment Area class 100     

Major process：
Film Attachment, OCA  Attachment, Assembly, UV Coating,  Silicone Coating,  Soldering, OCA repair

2F
Fab area：300 square meters  class 10000    
COG bonding area class 100 
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Major process: Cutting, COG bonding, FOG bonding, FOB bonding, ACF Attachment , TCP punch, COF punch.